| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that does not generate development residue while maintaining a high residual film ratio even when an aqueous tetramethylammonium hydroxide solution of 2.38 mass% is used as a developer in a patterned film formation step, and can form a patterned film with excellent low dielectric property without impairing physical characteristics of coating films such as light transmittance and solvent resistance even after high temperature baking. <P>SOLUTION: A photosensitive resin composition contains a component (A) comprising a specific copolymer, a component (B) comprising an esterified product having a quinonediazide group, a component (C) comprising a compound having two or more epoxy groups, and a component (D) comprising a specific phenol compound. The constitution ratio of each component is, 5 to 50 pts.mass of the component (B), 10 to 70 pts.mass of the component (C), and 1 to 40 pts.mass of the component (D) based on 100 pts.mass of the component (A). <P>COPYRIGHT: (C)2012,JPO&INPIT |
