发明名称 積層セラミック電子部品及びその実装基板
摘要 <p>There is provided a multilayered ceramic electronic component including a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second main surfaces, first and second end surfaces, and first and second side surfaces, a plurality of first and second internal electrodes, and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, include first and second head parts formed on the first and second end surfaces, and first and second band parts formed on the first and second main surfaces, and are not formed on the first and second side surfaces.</p>
申请公布号 JP5694456(B2) 申请公布日期 2015.04.01
申请号 JP20130150224 申请日期 2013.07.19
申请人 发明人
分类号 H01G4/232;H01G2/06;H01G4/30 主分类号 H01G4/232
代理机构 代理人
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