| 摘要 |
<p>This method for correcting a defect location includes: a step for producing ultrasonic vibration at the surface of an article under inspection, to which a conductor tape has been adhered; a step for detecting the F echo and B echo of the ultrasonic vibration; a step for detecting a suspected defect due to the conductor tape, on the basis of the detected values of the F echo and B echo; a step for acquiring location information for the suspected defect; a step for acquiring a differential of the location information for the suspected defect, on the basis of the location information for the suspected defect; and a step for correcting location information for an internal defect, on the basis of the differential.</p> |
