| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a configuration suitable for high density circuit board and capable of preventing electrostatic conduction between a pair of lands in the unmounted state, of an electronic device having a pair of lands provided on one surface of a circuit board. <P>SOLUTION: In an electronic device including a circuit board 10, and a first land 21 and a second land 22 provided contiguously to each other and electrically independently on one surface of the circuit board 10, a dummy wiring pattern 32 exposed as electrically independent surface wiring is provided separately from both lands 21, 22, at a position closer than a distance L between the first and second lands 21, 22 on the outside thereof, so that static electricity generated between the dummy wiring pattern 32 and any one of the lands 21, 22 is dissipated via the dummy wiring pattern 32. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
