METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS IN THREE DIMENSIONS

摘要

3D interconnection method of casings or circuits containing electronic components and connecting conductors, where the casings or circuits are stacked in the form of a block (3') by encapsulation by an insulator, involves: (a) the cutting of block by leaving the extremities of conductors (21) indented with respect to corresponding faces (302); (b) the cutting of grooves (40,41) in the faces and perpendicular ones; (c) the metallization of block and the grooves; (d) polishing the faces to remove metallization; (e) encapsulation by resin (303); and (f) metallization of block to ensure shielding (304). The method also includes, in a variant of invention, for supplying power to circuits, a Bus bar, and at step (b) at least one of the grooves cuts into the extremities of two adjacent conductors; the method includes an additional step, that is (g) the cutting of second grooves in the bottom of first grooves in full length, implemented between steps (c) and (e). The width of second grooves is less than that of first grooves. The cutting of grooves is done by sawing, or by use of laser. In another variant of invention, the method comprises an additional step, that is (h) the introduction of a capacitor by bonding plates to lateral faces of groove by a conducting adhesive, which is implemented before step (e). An electronic device with interconnections in three dimensions comprising casings or circuits with connecting conductors and encapsulated to form a block, is made with grooves and metallization according to the method. The metallization is interrupted in full length of second grooves.