发明名称 パターン形成方法、パターン形成装置及び半導体装置の製造方法
摘要 <p>According to one embodiment, a pattern forming method using a template containing a pattern that has at least one recess section or protrusion section to transfer the shape of the pattern to a resin layer on a substrate, is provided. The method includes a process for coating the resin on the substrate, a process for making the hardness of the first portion as a portion of the resin higher than the hardness of the second portion as the portion other than the first portion, and a process in which the portion other than the pattern of the template makes contact with the first portion, in a state where a gap is maintained between the template and the resin, the shape of the pattern is transferred to the second portion, and the resin is cured. Embodiments of an apparatus for pattern forming are also provided.</p>
申请公布号 JP5693488(B2) 申请公布日期 2015.04.01
申请号 JP20120034461 申请日期 2012.02.20
申请人 发明人
分类号 H01L21/027;B29C59/02;G03F7/20 主分类号 H01L21/027
代理机构 代理人
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