| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for improving film-forming performance of a plasma film-forming apparatus.SOLUTION: A plasma film-forming apparatus 100 is equipped with a film-forming chamber 110 in which a substrate 10, which is a film formation target, is arranged and to which a raw material gas is supplied. In the film-forming chamber 110, outer peripheral deposition shield plates 143 are arranged so as to face the planes and the side end surfaces of the substrate 10. The outer peripheral deposition shield plates 143 prevent deposition of stains onto walls of the film-forming chamber 110. The outer peripheral deposition shield plates 143 also function as electrodes for generating plasma of the raw material gas. Each of the outer peripheral deposition shield plates 143 is arranged so that, when it undergoes thermal expansion during a film-forming treatment, its edge can be displaced in a direction along the plate surface or the side end surface of the substrate 10. |
