发明名称 |
Semiconductor device leadframe |
摘要 |
<p>For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.</p> |
申请公布号 |
EP2854161(A1) |
申请公布日期 |
2015.04.01 |
申请号 |
EP20130186180 |
申请日期 |
2013.09.26 |
申请人 |
NXP B.V. |
发明人 |
VAN STRATEN, FREEK,EGBERT;INCOMIO, JEREMY, JOY, MONTALBO;REIJS, ALBERTUS |
分类号 |
H01L21/56;H01L23/433;H01L23/495;H01L23/498 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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