| 摘要 |
To provide a film formation apparatus and a film formation method for forming a metal film that can continuously form metal films with desired thickness on the surfaces of a plurality of substrates, and increase the film forming speed while suppressing abnormality of the metal films. A film formation apparatus includes an anode (11); a solid electrolyte membrane (13) disposed between the anode and a substrate (B) serving as a cathode such that a metal ion solution (L) is disposed on the anode (11) side thereof; and a power supply portion (14) adapted to apply a voltage across the anode (11) and the substrate (B). A voltage is applied across the anode (11) and the substrate (B) to deposit metal out of the metal ions contained in the solid electrolyte membrane (13) onto the surface of the substrate (B), thereby forming a metal film (F) made of the metal of the metal ions. The anode (11) has a base material (11a), which is insoluble in the metal ion solution (L), and a metal plating film (11c), which is made of the same metal as the metal film (F), formed over the base material (11a). |
