| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a power module, in which the generation of a void is suppressed in a solder, and the adhesion between a power element and a base material can be improved. <P>SOLUTION: A film formation step is for blowing metal powder in a solid phase together with a compressed carrier gas to form a metal film, on a surface of the base material 11, for soldering the power element 15. The film formation method includes: a first film formation step of blowing the metal powder against the surface of the base material 11 at a blowing pressure such that the carrier gas is contained to form a first metal film 12 made of the metal powder, on the surface of the base material 11; and a second film formation step of blowing the metal powder against a surface of the first metal film 12 at a blowing pressure lower than the blowing pressure of the metal powder in the first film formation step to form a second metal film 13 made of the metal powder, on the surface of the first metal film. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
