发明名称 ミリ波通信装置筐体構造およびシールド状態検知方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a millimeter wave communication device housing structure which makes it possible to grasp defects in the housing shield structure affecting required RF characteristics from the outside. <P>SOLUTION: When a housing cover 1 having a shield wall 2 formed therein to divide up and shield a circuit board 6 with a circuit board GND plane 7 formed on both surface and reverse side thereof is fixed to a chassis 5 with fixing screws 4 on which the circuit board 6 is mounted, a cover ground plane 15 and a chassis plane ground part 8 respectively formed as ground parts on the bottom face of the shield wall 2 and the inner face of the chassis 5 are made to contact the circuit board GND plane 7 of the circuit board 6, in which way a housing structure to realize a shielded state of the circuit board 6 is constructed. At an arbitrary place within a region on the circuit board 6 with which the cover ground plane 15 of the shield wall 2 is in contact and in-plane with the circuit board GND plane 7 on the circuit board 6 is disposed a detection part 9 which detects a change in the contact state between the circuit board 6 and the shield wall 2 and the chassis 5 and converts a detected change into an electrical signal variation before being output. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5691819(B2) 申请公布日期 2015.04.01
申请号 JP20110108523 申请日期 2011.05.13
申请人 发明人
分类号 H05K9/00 主分类号 H05K9/00
代理机构 代理人
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