电路基板、电路基板的制造方法及电子机器;CIRCUIT BOARD, PRODUCTION METHOD OF CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT

摘要

本发明之课题是提供制程短且可获得均一之厚度之电路基板等。本发明电路基板的制造方法包含有以下步骤：使可塑性变形之绝缘材料密合于具有以第2金属形成之第2金属层及以图形形状形成于前述第2金属层上并且至少含有与前述第2金属不同之金属的第1金属层之积层体之前述第2金属层形成有前述第1金属层之面上及前述第1金属层上后，将前述绝缘材料硬化，接着去除前述第2金属层，以形成形成有图形形状之前述第1金属层的板状构造物之步骤；从与前述板状构造物之形成有前述第1金属层之面相反侧之面对业经硬化之前述绝缘材料开设到达前述第1金属层之孔之步骤；于前述孔填充导电浆料，以形成填充有前述导电浆料之前述板状构造物之步骤；将一个填充有前述导电浆料之前述板状构造物与另一个填充有前述导电浆料之前述板状构造物积层为一个填充有前述导电浆料之前述板状构造物之前述第1金属层与另一个填充有前述导电浆料之前述板状构造物之前述孔的开口部对向之步骤。; opening hole in cured material from surface of the plate structure opposite to surface thereof where first-metal-layer is formed, until the hole reaches first-metal-layer；; and laminating one plate structure filled therewith with the other plate structure filled therewith in manner that first-metal-layer of one plate structure filled therewith faces opening of the hole of other plate structure filled therewith, wherein first-metal-layer contains metal different from second metal.