层叠式封装结构及其制法;PACKAGE ON PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

一种层叠式封装结构及其制法，该制法系包括：提供第一封装件，其系包括：介电层，系具有相对之第一表面与第二表面；层叠线路层，系嵌埋于该介电层中，且外露于该第一表面与第二表面；复数金属柱，系设于该介电层的第一表面上，且电性连接该层叠线路层；半导体晶片，系接置于该介电层的第一表面上，且电性连接该层叠线路层；及封装胶体，系形成于该介电层的第一表面上，并包覆该半导体晶片与金属柱，且具有复数对应外露该金属柱之顶端的封装胶体开孔；以及于该封装胶体上接置第二封装件，使该第二封装件电性连接该等金属柱。本发明能有效增进产能与良率。; a stacked line layer which is embedded into the dielectric layer and exposed on the first surface and the second surface; a plurality of metal columns which are provided in the first surface of the dielectric layer and electrically connected to the stacked line layer; a semiconductor wafer which is connectively disposing on the first surface of the dielectric layer and electrically connected to the stacked line layer; and a package colloid which is formed on the first surface of the dielectric layer and covers the semiconductor wafer and the metal columns, and has a plurality of package colloid openings correspondingly exposing on the top of the metal columns; and connectively disposing a second package on the package colloid so as to electrically connect the second package with the metal column. The present invention can effectively improve production capacity and yield.