发明名称 偏在率算出方法、半導体装置の製造方法及びプログラム
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an uneven distribution rate calculation method capable of determining whether or not there exists such a type or layer that Cu residue is likely to be generated from layout data. <P>SOLUTION: A CPU is configured to execute: a step S13 of calculating pattern density for each verification area of a predetermined size in a verification layer; a step S14 of discriminating the calculated pattern density into a plurality of density ranges, and creating a plurality of density maps MAP0 to MAP7 showing the distribution of pattern density belonging to each density range; a step S15 of adding predetermined amounts of plus shift to each of those density maps MAP0 to MAP7; a step S16 of overlapping the density maps MAP0 to MAP7 combined such that the density difference of the pattern density becomes a first reference value or more, and extracting an area overlapped in the both density maps; a step S17 of calculating the total area of the extracted areas; and a step S18 of comparing the calculated total area with a second reference value. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5692522(B2) 申请公布日期 2015.04.01
申请号 JP20110084574 申请日期 2011.04.06
申请人 发明人
分类号 G06F17/50;H01L21/304;H01L21/3205;H01L21/321;H01L21/768;H01L21/82;H01L23/522 主分类号 G06F17/50
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