| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a liquid resin composition for an electronic component that shows good fluidity at a narrow gap, and is superior in adhesion to an electronic component member and low stress, and to provide an electronic component device sealed with the composition with high reliability (moisture resistance and thermal impact resistance). <P>SOLUTION: The liquid resin composition for an electronic component for sealing the electronic component includes: (A) a liquid epoxy resin; (B) a curing agent containing a liquid aromatic amine; (C) a silicone polymer particle; and (D) an inorganic filler. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
