发明名称 Organic light emitting diode display and method of manufacturing the same
摘要 An organic light emitting diode display includes a flexible substrate, an organic light emitting diode disposed over the flexible substrate, and an encapsulation film disposed over the flexible substrate to encapsulate the organic light emitting diode, with the organic light emitting diode interposed between the encapsulation film and the flexible substrate. A thermal conduction layer contacts the flexible substrate, wherein the thermal conduction layer faces the organic light emitting diode and the flexible substrate is interposed between the thermal conduction layer and the organic light emitting diode. A first film is disposed over the encapsulation film, and a second film is disposed over the thermal conduction layer.
申请公布号 US8994063(B2) 申请公布日期 2015.03.31
申请号 US201012946710 申请日期 2010.11.15
申请人 Samsung Display Co., Ltd. 发明人 Lee Jae-Seob;Jin Dong-Un
分类号 H01L33/00;H01L51/00;H01L51/52;H01L23/29 主分类号 H01L33/00
代理机构 Knobbe Martens Olson & Bear LLP 代理人 Knobbe Martens Olson & Bear LLP
主权项 1. A method of manufacturing a light emitting diode display, the method comprising: forming a flexible substrate over a glass substrate; forming an organic light emitting diode over the flexible substrate; forming an encapsulation film over the flexible substrate to encapsulate the organic light emitting diode; separating the glass substrate from the flexible substrate; forming a perforated thermal conduction layer on a flat surface of the flexible substrate separated from the glass substrate such that the perforated thermal conduction layer contacts the flexible substrate; coupling a first film to the encapsulation film; and coupling a second film to the thermal conduction layer, wherein the perforated thermal conduction layer has a plurality of perforations disposed in a portion of the thermal conduction layer in contact with the flexible substrate.
地址 KR