| 发明名称 | Membrane wiring board | ||
| 摘要 | The present invention is a membrane wiring board provided with an insulating substrate, and at least one circuit portion provided on the insulating substrate and obtained by coating a circuit layer, formed by an electrically conductive paste containing electrically conductive particles, with an insulating coating layer, wherein the circuit layer contains a resin component having a gel fraction of 90% or more. | ||
| 申请公布号 | US8993895(B2) | 申请公布日期 | 2015.03.31 |
| 申请号 | US201213631202 | 申请日期 | 2012.09.28 |
| 申请人 | Fujikura Ltd. | 发明人 | Koshimizu Kazutoshi |
| 分类号 | H05K1/09;H05K1/00;H05K1/03;H01L23/498;H01L21/48;H05K3/46;C09D11/52;H01B1/22;C09D4/00;C08K3/08;C08K7/00;C08K7/18;C08F222/10 | 主分类号 | H05K1/09 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A membrane wiring board comprising: an insulating substrate; and at least one circuit portion provided on the insulating substrate and obtained by coating a circuit layer, formed by an electrically conductive paste containing electrically conductive particles, with an insulating coating layer, wherein the circuit layer contains a resin component having a gel fraction of 90% or more; wherein, in the case a value of 100% by mass is assigned to a total amount of the electrically conductive particles and the resin composition in the electrically conductive paste, the electrically conductive particles are contained at a ratio of 70% by mass to 95% by mass and the resin composition is contained at a ratio of 5% by mass to 30% by mass. | ||
| 地址 | Tokyo JP | ||