Package for an implantable neural stimulation device

摘要

An implantable device, including a first electrically non-conductive substrate with a plurality of electrically conductive vias. The device also includes a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps, the circuit being electrically connected to at a subset of the plurality of electrically conductive vias. Another a flip-chip driver circuit is attached to the flip-chip multiplexer circuit using conductive bumps while a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps. Discrete passives are attached to the second electrically non-conductive substrate and a cover is bonded to the first electrically non-conductive substrate. The cover, the first electrically non-conductive substrate and the electrically conductive vias form a hermetic package.

主权项

1. An implantable device, comprising:
a first electrically non-conductive substrate; a plurality of electrically conductive vias through the first electrically non-conductive substrate; conductive traces deposited on the first electrically non-conductive substrate, the first electrically non-conductive substrate, electrically conductive vias and conductive traces forming a base; a flip-chip circuit attached to the base using conductive bumps; a stack chip circuit bonded to the flip chip circuit and wire bonded to the base; a second electrically non-conductive substrate bonded to the stack chip circuit and wire bonded to the base; discrete passives attached to the second electrically non-conductive substrate; a braze stop on said first electrical nonconductive substrate and along a periphery of said electrically non-conductive substrate surrounding the plurality of electrically conductive vias and separating a braze joint from said plurality of electrically conductive vias; and a cover bonded to the base, the cover and the base forming a hermetic package.