| 发明名称 | Light emitting device package and light unit having the same | ||
| 摘要 | Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other. | ||
| 申请公布号 | US8994038(B2) | 申请公布日期 | 2015.03.31 |
| 申请号 | US201414509321 | 申请日期 | 2014.10.08 |
| 申请人 | LG Innotek Co., Ltd. | 发明人 | Kong Sung Min;Kim Choong Youl;Choi Hee Seok |
| 分类号 | H01L27/15;H01L29/267;H01L21/12;H01L33/00;H01L33/62;H01L33/32 | 主分类号 | H01L27/15 |
| 代理机构 | Birch, Stewart, Kolasch & Birch, LLP | 代理人 | Birch, Stewart, Kolasch & Birch, LLP |
| 主权项 | 1. A light emitting device package, comprising: a package body comprising a cavity in a first region; a lead frame on the cavity; and a GaN based LED Chip on the lead frame, wherein a length of the cavity in a first direction is greater than a width of the cavity in a second direction, wherein the lead frame comprises a bottom frame and sidewall frames, wherein the sidewall frames are inclined with respect to the second direction, wherein an interval between the sidewall frames is at least 2.3 times greater than a cavity depth of the lead frame, and wherein a width of the bottom frame is at least 1.3 times greater than the cavity depth of the lead frame. | ||
| 地址 | Seoul KR | ||