| 发明名称 |
Chip card module |
| 摘要 |
In various aspects of the disclosure, a chip card module is provided. The chip card module may include a flexible substrate having a metallization on a first and second major surface, or side, thereof. An integrated circuit affixed to the second side is oriented with chip pads facing away from the substrate. Wire bonds may connect the chip pads to the metallizations. |
| 申请公布号 |
US8991711(B2) |
申请公布日期 |
2015.03.31 |
| 申请号 |
US201213552660 |
申请日期 |
2012.07.19 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Pueschner Frank;Pohl Jens;Hoegerl Juergen;Schindler Wolfgang |
| 分类号 |
G06K19/06;H01L21/48;H01L23/498;H01L23/31;H01L23/00 |
主分类号 |
G06K19/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip card module comprising:
a flexible substrate having a first and second major surface; a first metallization on said first major surface providing at least one discreet electrical contact area; a second metallization on said second major surface forming at least one discreet electrical lead; at least one via establishing electrical contact between said first metallization and said second metallization; a device mounted to said second major surface, the device having at least one electrical contact pad disposed thereon, said contact pad facing away from the second major surface; and at least one bond wire electrically connecting said contact to said electrical lead. |
| 地址 |
Neubiberg DE |
