发明名称 Method of producing an optoelectronic component and component
摘要 A method of producing an optoelectronic component including providing an epitaxially grown layer sequence on a growth substrate, which comprises a suitable layer for light emission; applying a metal layer to the epitaxially grown layer sequence; applying a molding support to the metal layer, the molding support including a support material with a first coefficient of thermal expansion and a fiber mesh with a second coefficient of thermal expansion functionally bonded to the support material; and detaching the growth substrate.
申请公布号 US8994040(B2) 申请公布日期 2015.03.31
申请号 US201113992046 申请日期 2011.12.05
申请人 OSRAM Opto Semiconductors GmbH 发明人 Lindberg Gudrun
分类号 H01L29/18;H01L33/00;H01L33/36;H01L21/00 主分类号 H01L29/18
代理机构 DLA Piper LLP (US) 代理人 DLA Piper LLP (US)
主权项 1. An arrangement of a plurality of optoelectronic components spaced apart from one another on a tape, the optoelectronic components comprising: an epitaxially grown layer sequence suitable for light emission in a main direction; a metal layer on a side of the epitaxially grown layer sequence remote from the main direction; and a molding support with a support material with a first coefficient of thermal expansion and with a fiber mesh with a second coefficient of thermal expansion functionally bonded to the support material; wherein part of the fiber mesh and of the support material is arranged in interspaces between two adjacent components.
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