发明名称 |
Method of producing an optoelectronic component and component |
摘要 |
A method of producing an optoelectronic component including providing an epitaxially grown layer sequence on a growth substrate, which comprises a suitable layer for light emission; applying a metal layer to the epitaxially grown layer sequence; applying a molding support to the metal layer, the molding support including a support material with a first coefficient of thermal expansion and a fiber mesh with a second coefficient of thermal expansion functionally bonded to the support material; and detaching the growth substrate. |
申请公布号 |
US8994040(B2) |
申请公布日期 |
2015.03.31 |
申请号 |
US201113992046 |
申请日期 |
2011.12.05 |
申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Lindberg Gudrun |
分类号 |
H01L29/18;H01L33/00;H01L33/36;H01L21/00 |
主分类号 |
H01L29/18 |
代理机构 |
DLA Piper LLP (US) |
代理人 |
DLA Piper LLP (US) |
主权项 |
1. An arrangement of a plurality of optoelectronic components spaced apart from one another on a tape, the optoelectronic components comprising:
an epitaxially grown layer sequence suitable for light emission in a main direction; a metal layer on a side of the epitaxially grown layer sequence remote from the main direction; and a molding support with a support material with a first coefficient of thermal expansion and with a fiber mesh with a second coefficient of thermal expansion functionally bonded to the support material; wherein part of the fiber mesh and of the support material is arranged in interspaces between two adjacent components. |
地址 |
DE |