Top wafer rotation and support

摘要

Embodiments of the present invention provide thermal processing chambers including a drive mechanism and a heating assembly disposed on opposite sides of a substrate support assembly. Particularly, the heating assembly is disposed below the substrate support assembly to process a substrate with a device side facing up and the drive mechanism is disposed above the substrate assembly.

主权项

1. An apparatus for thermal processing a substrate, comprising:
a chamber body defining a processing volume; a heating assembly disposed under the processing volume, wherein the heating assembly comprises a plurality of radiant heating sources directing radiant energy toward the processing volume; a substrate support assembly operable to position a substrate over the heating assembly in the processing volume; and a drive mechanism operable to rotate the substrate support assembly and move the substrate assembly vertically, wherein the drive mechanism is disposed above the substrate support assembly, wherein the substrate support assembly comprises:
a disk disposed in the processing volume, wherein the disk has a lower surface facing the heating assembly and an upper surface facing a chamber lid, and the disk is connected to the drive mechanism from the upper surface; anda plurality of brackets extending from the lower surface of the disk, wherein the plurality of brackets form a supporting surface.