| 摘要 |
<p>A resin composition having high Tg (high heat resistance), low thermal expansion, and excellent flame retardancy, and being advantageous for promoting halogen-free, and having excellent adhesiveness with Cu, a prepreg obtained by impregnating it into substrate, and a composite and a laminate obtained from them. Specifically provided are a modified polyimide resin composition containing (A) a polymaleimide compound of formula [1], (B) epoxy resin having at least two glycidyl groups in the molecule of formula [2], and (c) phenolic compound having at least two OH groups in the molecule, and a prepreg obtained by impregnating the composition into the substrate, and a composite and a laminate obtained from the prepreg.</p> |
