发明名称 A 3D SOLID-STATE ARRANGEMENT FOR SOLID-STATE MEMORY
摘要 <p>The present invention generally relates to the three-dimensional arrangement of memory cells. This 3D arrangement and orientation is made with macro cells that enable the programming, reading and/or querying of any memory cell in the 3D array without the need for overhead wiring or by utilizing a minimal amount of overhead wiring. The individual macro cells are electrically coupled together such that a single transistor on the substrate can be utilized to address multiple macro cells. In such an arrangement, all the auxiliary circuits for addressing memory elements are simplified thereby diminishing their integrated circuit area.</p>
申请公布号 KR101507029(B1) 申请公布日期 2015.03.31
申请号 KR20130007377 申请日期 2013.01.23
申请人 发明人
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
代理机构 代理人
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