| 发明名称 | Method of manufacturing liquid ejecting head, method of manufacturing liquid ejecting apparatus and method of manufacturing piezoelectric element | ||
| 摘要 | A method of manufacturing a liquid ejecting head includes forming a first electrode made of platinum, forming a buffer layer made of a compound having a pyrochlore structure that contains bismuth or platinum on the first electrode, forming an oxide layer made of an oxide containing bismuth on the buffer layer, forming a piezoelectric layer made of a compound having a perovskite structure that contains bismuth by burning the oxide layer, and forming a second electrode on the piezoelectric layer. | ||
| 申请公布号 | US8991052(B2) | 申请公布日期 | 2015.03.31 |
| 申请号 | US201213707035 | 申请日期 | 2012.12.06 |
| 申请人 | Seiko Epson Corporation | 发明人 | Sakai Tomohiro |
| 分类号 | B21D53/00;H01L41/22;B41J2/16;H01L41/187;H01L41/318;H01L41/319;B41J2/14 | 主分类号 | B21D53/00 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A method of manufacturing a liquid ejecting head comprising: forming a first electrode made of platinum; forming a buffer layer made of a compound having a pyrochlore structure that contains bismuth (Bi) or platinum (Pt) on the first electrode; forming an oxide layer made of an oxide containing bismuth on the buffer layer; forming a piezoelectric layer made of a compound having a perovskite structure that contains bismuth by burning the oxide layer; and forming a second electrode on the piezoelectric layer. | ||
| 地址 | JP | ||