SEMICONDUCTOR DEVICE AND SEMICONDUCTOR RELAY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve downsizing of a semiconductor substrate; and provide a semiconductor relay using the semiconductor device.SOLUTION: A semiconductor device comprises: an input circuit (oscillation circuit 20); output circuits (diodes 212-214 and charge/discharge circuit 22); capacitors 210, 211; an insulation circuit for electrically isolating the input circuit and the output circuits; and a semiconductor substrate 7 on which the circuits are formed. Each of the capacitors 210, 211 is formed such that a first electrode 80, 82 of two electrodes is connected to the input circuit and the other second electrode 81, 83 is connected to the output. The insulation circuit is formed between each of the capacitors 210, 211 and the semiconductor substrate 7 in a thickness direction of the semiconductor substrate 7 and has an insulation film 9 composed of a dielectric substance.