| 摘要 |
<p>PROBLEM TO BE SOLVED: To precisely cut an adhesive body such as a sealing sheet pasted to a substrate such as a semiconductor wafer for an extended period.SOLUTION: A wire 63 that is delivered in one direction from a reel for running is guided between guide pins 66, and the wire 63 is electrified through the guide pins 66, so that the wire 6 between the guide pins is heated. The wire 63 is made to abut with an outer periphery of the substrate W that is held by a suction table 51 having a diameter smaller than the substrate W, and a cut is made on a sealing sheet T protruding from the substrate W in a radial direction, and after that, the suction plate 51 is rotated so that the wire 63 is made to follow the outer periphery of the substrate W, for cutting an extra portion of the sealing sheet T.</p> |
