RIGID FLEXIBLE MULTILAYER PRINTED WIRING BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method capable of more easily manufacturing a compact size rigid flexible multilayer printed wiring board even when a splitting process is performed in two stages from a surface to from a rear face.SOLUTION: A manufacturing method of a rigid flexible multilayer printed wiring board composed of a rigid part capable of component mounting and a bendable rigid part comprises: a step of forming a rigid printed wiring board; a step of forming a first splitting process part 12 which reaches an intended depth from one surface in a flexible part formation region; a step of arranging an insulation adhesive layer in a region except the flexible part formation region ; a step of laminating a flexible substrate; and a step of forming a second splitting process part which reaches the first splitting process part from the other surface of the rigid printed wiring board. The splitting step of forming the second splitting process part is performed by setting a region which enters the flexible part by a position gap tolerance 22 in each of XY directions from a boundary between the flexible part and the rigid part as a set process range 23.