WIRING BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method of simultaneously forming wiring layers on both surfaces of a substrate, which can form a structure capable of forming fine wiring on one surface of the substrate and a structure on the other surface, which does not correspond to the fine wring but achieves an inexpensive price.SOLUTION: A wiring board manufacturing method comprises the steps of: stacking a first insulation layer 64 and a first protection layer 66 on one surface side of a core substrate; stacking a second insulation layer 60 and a second protection layer 62 on the other surface of the core substrate 32; forming a first opening 68 in the first insulation layer 64 and the first protection layer 66; forming a second opening 70 in the second insulation layer 60 and the second protection layer 62; peeling off the second protection layer 62; forming a first conductive layer 72 on the first protection layer 66 and an inner wall of the first opening 68; forming a second conductive layer 74 on the second insulation layer 60 and an inner wall of the second opening 70; removing the first protection layer 66 together with the first conductive layer; forming a third conductive layer 76 on the first insulation layer 64 and an inner wall of the fist opening 68; forming a first wiring layer 86 on the third conductive layer; and forming a second wiring layer 88 on the second conductive layer 74.