发明名称 PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a pattern inspection apparatus and the like, by which patterns formed on top and back surfaces of a transparent substrate can be inspected with high accuracy.SOLUTION: A pattern inspection apparatus is adapted for inspection of appearances of wiring patterns 23, 25 formed on top and back surfaces of a transparent film 11, and the apparatus includes: an imaging unit for imaging inspection light that is transmitted through the transparent film 11; and an image processing unit for carrying out inspection by determining whether or not the wiring patterns 23, 25 are acceptable by using an image acquired by the imaging unit. On the transparent film 11, positioning marks 27, 29 in different shapes are formed respectively corresponding to the wiring patterns 23, 25; and the image processing unit aligns a reference pattern 43 by referring the mark 27 on the image, sets the region of the reference pattern 43 as an inspection region of the wiring pattern 23, and aligns the reference pattern by referring the mark 29 on the image, and sets the region of the reference pattern as an inspection region of the wiring pattern 25.</p>
申请公布号 JP2015060493(A) 申请公布日期 2015.03.30
申请号 JP20130195108 申请日期 2013.09.20
申请人 DAINIPPON PRINTING CO LTD 发明人 TSUJI NAOKI;TOTSUKA TAKAYUKI
分类号 G06T1/00;G01N21/892;G01N21/956 主分类号 G06T1/00
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