| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized and highly reliable semiconductor device.SOLUTION: A plurality of inverted pyramid-shaped recesses 2 are provided in a semiconductor chip mounting region 3 in a surface of an island portion 1 for mounting the semiconductor chip thereon. The inverted pyramid-shaped recesses 2 are arranged so that at least one side of each inverted pyramid-shaped recess 2 faces in parallel to a nearest outer periphery of the rectangle semiconductor chip mounting region 3 and the vertex on the opposite side to the one side faces the inside of the semiconductor chip mounting region 3. |
