发明名称 METHOD FOR PRODUCING METALLIC THIN FILM, METALLIC THIN FILM RESIN SUBSTRATE AND PRINTED CIRCUIT BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for producing a metallic thin film with a low resistivity having excellent conductivity from a metallic fine particle-dispersed body by super heat steam treatment, and a printed circuit board produced by the method.SOLUTION: Provided is a method for producing a metallic thin film, including a process in which a coating film containing metallic fine particles is formed using a metallic fine particle-dispersed body on a heat resistant resin layer, and thereafter, heating treatment with super heat steam is performed, in which the thermal shrinkage of the heat resistant resin layer upon treatment at 350°C for 2 hr is 0.3% or lower.</p>
申请公布号 JP2015059233(A) 申请公布日期 2015.03.30
申请号 JP20130192750 申请日期 2013.09.18
申请人 TOYOBO CO LTD 发明人 IMAHASHI SATOSHI;OGI KOJI;TAKIMOTO GOTA;KINAMI KAZUNORI
分类号 B22F3/10;B22F1/00;B22F9/00;C08J7/04;H01B1/20;H01B1/22;H01B5/14;H01B13/00;H05K1/09 主分类号 B22F3/10
代理机构 代理人
主权项
地址