发明名称 Moulding compound based on a partially aromatic copolyamide
摘要 <p>A molded article with improved heat aging resistance made of a molding compound containing 40 wt% or more of components: a) 60-99 parts by weight of a copolyamid based on hexamethylene diamine, terephthalic acid, and lactam, and/orω-aminocarboxylic acid with 11 or 12 carbon atoms; b) 1-40 parts by weight of an olefin-based copolymer containing a monomer unit which is based on an aliphatic unsaturated dicarboxylic acid anhydride based on 1-alkene with four to eight carbon atoms based on ethene and is based on another random olefin, wherein total parts by weight of a) and b) is 100.</p>
申请公布号 KR20150032812(A) 申请公布日期 2015.03.30
申请号 KR20140124922 申请日期 2014.09.19
申请人 EVONIK INDUSTRIES AG 发明人 NITSCHE JASMIN;HAEGER HARALD;GEERKENS SEBASTIAN;BAUMANN FRANZ ERICH;BEUTH REINHARD
分类号 C08G69/08;C08G69/26;C08J5/00;C08L57/04;C08L77/00 主分类号 C08G69/08
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