| 摘要 |
<p>PROBLEM TO BE SOLVED: To facilitate reliable assembly of a semiconductor device.SOLUTION: In the assembly of a QFN (Quad Flat Non-leaded package), a lead frame 2 having a lower surface with a tape attached thereon is used, and a plurality of tie bars 2f are formed so that the thickness of an intersection 2h between a tie bar 2fa and a tie bar 2fb, the thickness of a suspension lead connection portion 2fd to which a suspension lead 2c is connected, and the thickness of a third portion 2fi between the intersection 2h and the suspension lead connection portion 2fd are each greater than the thickness of the suspension lead 2c. As a result, a portion extending from the intersection 2h to an end lead connection portion 2ff is formed thick, and molding can be conducted in a state where the tape is stuck to the lower surface side of the portion. Consequently, it is possible to prevent the tape from being peeled during molding.</p> |
