发明名称 METHOD OF MANUFACTURING ULTRASONIC THICKNESS SENSOR, AND ULTRASONIC THICKNESS SENSOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing an ultrasonic thickness sensor and an ultrasonic thickness sensor, capable of preventing breakage and peeling of a sintering material layer due to dry shrinkage and achieving a highly-sensitive piezoelectric sensor.SOLUTION: A method of manufacturing an ultrasonic thickness sensor includes the steps of: thermally processing lead zirconate titanate (PZT) of a powder at a temperature not less than 1000°C and not more than 1200°C (thermal processing step P1); pulverizing the PZT thermally processed by the thermal processing step P1 (pulverizing step P2); forming a slurry by mixing the PZT pulverized by the pulverizing step P2 with a sol of the PZT (slurry forming step P3); forming a sintering material layer by depositing the slurry formed in the slurry forming step 3 on a first electrode (depositing step P4); obtaining a piezoelectric ceramic precursor by sintering the sintering material layer (sintering step P5); obtaining a piezoelectric ceramic by polarizing the piezoelectric ceramic precursor (polarizing step P6); and forming a second electrode on the piezoelectric ceramic (electrode forming step).</p>
申请公布号 JP2015060894(A) 申请公布日期 2015.03.30
申请号 JP20130192405 申请日期 2013.09.17
申请人 MITSUBISHI HEAVY IND LTD 发明人 NANBA KATSUMI;MORI KAZUTAKA;YAMAMOTO YUKO
分类号 H01L41/113;G01B17/02;H01L41/187;H01L41/257;H01L41/273;H01L41/29;H01L41/43 主分类号 H01L41/113
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