| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a photodetector capable of enhancing flexibility of gaps between adjoining light-receivers so as to miniaturize a total area of the light-receiving regions, and a sensor package having the same.SOLUTION: A color sensor chip 3 includes a semiconductor substrate 10 on which a photo diode 14R and a photo diode 14B are formed with a gap therebetween, and a color filter 11 which is formed on the semiconductor substrate 10, and includes a red filter 19R arranged so as to cover the photo diode 14R and a blue filter 19B arranged so as to cover the photo diode 14B. In the color sensor chip 3, a filter layer structure 22 is formed of overlapping of respective periphery parts 21R and 21B of the red filter 19R and the blue filter 19B in an n-type boundary region 17 between the photo diode 14R and the photo diode 14B on the color filter 11.</p> |
