| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer mounting member capable of improving uniformity of temperature distribution on a wafer surface, which promotes growth of crystallization of a compound semiconductor by changing optical permeability of an SiC film formed on a surface of a wafer mounting member, resulting in improved quality of a semiconductor thin film that is formed on a wafer.SOLUTION: In a wafer mounting member in which an SiC film of specified film thickness is formed on a surface of a substrate, the optical permeability of the SiC film in a specific region that is formed on the substrate surface is different from that of the SiC film in a region other than the specific region formed on the substrate surface. |
