| 摘要 |
PROBLEM TO BE SOLVED: To provide a Bi solder alloy which does not substantially contain Pb, has a solidus temperature of 265°C or more and a liquidus temperature of 390°C or less and is excellent in machinability, mechanical strength and joint reliability.SOLUTION: A Bi base solder alloy contains Ag and Al, does not substantially contain Pb, has a Bi content of 80 mass% or more and has melting point solidus line of 265°C or more and liquidus line of 390°C or less. Therein, the content of Ag is 0.6 to 18 mass%, the content of Al is 0.1 to 3 mass% and is 1/20 to 1/2 of the content of Ag and particles which contain an intermetallic compound of Ag and Al are dispersed in the solder alloy. |
