发明名称 RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED RESIN ARTICLE WITH PLATED LAYER
摘要 <p>Provided is a resin composition capable of achieving a higher plating property. The resin composition comprises relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass filler and 2 to 20 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive comprises a metal oxide, a component of the largest blending amount among the metal components is tin, a component of the second largest blending amount is antimony, and in addition lead and/or copper are contained.</p>
申请公布号 KR101507292(B1) 申请公布日期 2015.03.30
申请号 KR20147024111 申请日期 2013.09.12
申请人 发明人
分类号 B32B15/08;C08K3/22;C08K3/40;C08K7/14;C08L25/04;C08L69/00 主分类号 B32B15/08
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