| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive sheet that is excellent in all of unevenness followability, heat resistance and chemical resistance, and usable in a plurality of processes in semiconductor wafer processing.SOLUTION: A pressure sensitive adhesive sheet has a substrate layer, and an adhesive layer including an ultraviolet light curable pressure sensitive adhesive agent. The storage modulus G' of the adhesive layer at 22°C is 30 kPa or more. The storage modulus G' of the adhesive layer at 85°C is 30 kPa or less. When the adhesive layer is irradiated with ultraviolet light having characteristic wavelength of 365 nm at cumulative radiation of 300 mJ/cmby a high-pressure mercury-vapor lamp and is cured, the tensile elastic modulus of the adhesive layer at 22°C is 0.1-54 MPa. |
