| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board which achieves high connection reliability even if a through hole conductor has voids.SOLUTION: A through hole 10h is formed on a substrate 10, and conductor layers 11, 12 are formed on both sides of the substrate 10. A through hole conductor 10c formed in the through hole 10h includes an upper seed layer 81 and a lower seed layer 82 which close the through hole 10h. The through hole conductor 10c electrically connects the conductor layer 11 with the conductor layer 12.</p> |
