| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a flip chip bonder and a bonding method, high in productivity, or needing no change of a coating applicator for each die size to be used.SOLUTION: The present invention relates to a flip chip bonder or a bonding method in which a die having a bump is pick-upped by a pickup head, the pick-upped die is reversed, and a bonding head receives the die to bond the bump coated with a flux to a solder part of a workpiece. The pickup head contains a flux to be coated on the bump, sucks the die, and applies the flux to the bump.</p> |
