| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a piezoelectric device, excellent in vibration properties, capable of reducing cost by being produced by wafer level, and to provide a process of manufacturing the same.SOLUTION: The piezoelectric device includes: a piezoelectric vibration piece 110 having a vibration part 110b whose thickness is thinner compared to a peripheral part 110a; an intermediate films 120, 130 that is connected to the peripheral part 110a by being separated from the vibration part 110b on a front surface and a rear surface of the piezoelectric vibration piece 110; and encapsulation films 140, 150 that are laminated on the intermediate films 120, 130.</p> |
