Light emitting device package, backlight unit, lighting device and its manufacturing method

摘要

The present invention relates to a light emitting device package, a backlight unit, a lighting device, and a method for manufacturing the light emitting device package to be used for a display or lighting. The light emitting device package includes: a flip chip type light emitting device which includes a first pad and a second pad; a lead frame which includes a first electrode installed in one direction and a second electrode installed in the other direction based on an electrode separation space and receives the light emitting device; a first bonding medium which is installed between the first pad and the first electrode to electrically connect the first electrode of the lead frame to the first pad of the light emitting device; and a second bonding medium which is installed between the second pad and the second electrode to electrically connect the second electrode of the lead frame to the second pad of the light emitting device. At least one first receiving cup part which receives the first bonding medium is formed on the first electrode of the lead frame. At least one second receiving cup part which receives the second bonding medium is formed on the second electrode of the lead frame.