| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a new Cu-Ga alloy target material which can suppress the occurrence of cracks and chips during machining such as cutting and grinding and during sputter film deposition, can stably form a film at the time of sputter film deposition, and can suppress the generation of a nodule on a target material surface.SOLUTION: A Cu-Ga alloy target material comprises, by mass %, 25-35% of Ga and the balance being Cu and inevitable impurities, and contains 0.1% or less of C. Preferably, Vickers hardness of the Cu-Ga alloy target material is 450 HV or more.</p> |
