| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip resistor which can prevent the generation of solder balls and the cracking of components at the same time.SOLUTION: A chip resistor 1 comprises: a ceramic substrate 2 having a rectangular parallelepiped shape; a pair of front-face electrode 4 which are respectively arranged on both ends in the longitudinal direction on the front face of the ceramic substrate 2; a resistor 5 which is arranged, on the front face of the ceramic substrate 2, such that its both ends overlap the pair of front-face electrodes 4, respectively; a protective layer 6 covering the resistor 5; a pair of end-face electrodes 7 which are arranged on both end faces in the longitudinal direction of the ceramic substrate 2 so as to bridge rear-face electrodes 3 and the front-face electrodes 4; external electrodes 8, each having an U-shaped cross section, which cover the front-face electrodes 4, end-face electrodes 7, and rear-face electrodes 3, respectively; and an insulation layer 9 provided in a region, located at the center on the rear face of the ceramic substrate 2, which is sandwiched by both of the rear-face electrodes 3. The thickness of the insulation layer 9 is set to be greater than the thickness of where one of the rear-face electrodes 3 and one of the external electrodes 8 overlap each other.</p> |
