| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cutting device which suppresses enlargement of the cutting device resulting from increase in a diameter of a wafer and achieves a low possibility of damage of the wafer.SOLUTION: A cutting device includes: a chuck table (16) which holds a wafer (11); cutting means which cuts the wafer; a cassette (10) which houses the wafer; carry-out/in means (20) which carries out/in the wafer; transfer means (38) which transfers the wafer carried out by the carry-out/in means to a chuck table; and detection means (60) which detects a mark (13) of the wafer. The transfer means includes: a holding body (52) which holds the wafer; a suction pad (54) which suctions the wafer in a non-contact state; a clamp claw (56) which holds an outer periphery of the wafer; a rotation drive part (58) which rotates the wafer held by the clamp claw; moving parts (40, 50) which integrally move the holding body, the clamp claw, and the rotation drive part; and control means (64) which controls the transfer means.</p> |
