发明名称 CUTTING DEVICE AND CUTTING METHOD
摘要 The purpose of the present invention is to suppress thermal deformation from alignment to cutting by previously cooling an object to be cut at the same temperature as a set temperature of a water jet. In a twin cut table-type cutting device, cool air is supplied from a cool air generation unit to a loader. A substrate which is firmly attached to a fixing unit and is completely sealed is cooled by having cool air flow in a passage for cooling formed in a cooling part in the loader. The sealed substrate is contracted to be in the same state as the state of cutting by previously cooling the sealed substrate at the same temperature as a set temperature of a water jet. Alignment is performed when a substrate is contracted, thereby accurately cutting the substrate along a cutting line without error from alignment to cutting.
申请公布号 KR20150032771(A) 申请公布日期 2015.03.30
申请号 KR20140108225 申请日期 2014.08.20
申请人 TOWA CORPORATION 发明人 KATAOKA SHOICHI;YAMAMOTO MASAYUKI
分类号 H01L21/78 主分类号 H01L21/78
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