发明名称 Printed Circuit Board
摘要 <p>A printed circuit board includes a first insulating layer; a pad formed on the first insulating layer; a second insulating layer covered on the first insulating layer having the pad thereon; and a via hole formed in the second insulating layer. The pad has a surface that is non-planar.</p>
申请公布号 KR101506785(B1) 申请公布日期 2015.03.27
申请号 KR20130061086 申请日期 2013.05.29
申请人 发明人
分类号 H05K3/40;H05K3/46 主分类号 H05K3/40
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