摘要 |
<p>The present invention is related to a wire cutting tool used for cutting work of a material with high hardness such as a silicon ingot, a sapphire ingot, stone, a brick, or concrete, and to a manufacturing method thereof. More specifically, the wire cutting tool has a part of first and second deposition layers removed due to a dressing process of the wire cutting tool, thereby exposing an upper part of an abrasive particle to allow process completion to be checked easily.</p> |